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Peel strength of protective film from leadframe tape (see SEMI G75
自動搬送用は，ウェーハキャリアと自動ウェーハプロセス装置のインタフェースの使用上の要求事項を満たすものである。自動搬送用は125 mmウェーハサイズを対象としている。
which is the root of the SAN Standard
• type of PSL (reference material)
SEMI E158 — Specification For Mechanical Features of Fab Wafer Carrier Used To Transport and Store 450 mm Wafers (450 FOUP) and Kinematic Coupling
D05100 - SEMI D51 - Specification for Handshake Method of Single Substrate for Handling Off/On Tool in FPD Production Revision:SEMI D51-0709 - Inactive Peel strength of protective filmThis standard was technically approved by the global Flat Panel Display Factory Automation Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on May 13, 2009. It was available at www. semi. org in June 2009. Originally published March 2008. Due to the migration to large substrate sizes in FPD production, the demand for single substrate transfer, with the extensive combined use of Automated Material